Package inspection
Scratch,stain,damage,insufficient filling,overflow ect.

Label verification
Part NO.,date code,Country of Origin,Serial No.,Quanlity, Safety level.

Printing inspection
Typo,offset,missing printing, overprint, blur, tilt, displacement, hyphenation, double-layer printing, no word mold etc.

Pin detection
Missing pins,damaged pins,pin spacing,pin width,pin bending,pin span,pin length difference,pin standing height, pin coplanarity, pin inclination etc.

X-ray inspection
Defect inspection in IC packaging, such as layer peeling, burst, cavity and integrity inspection of wiring; Chip size measurement, line arc measurement, component tin area ratio measurement.